Amkor — Supply Chain & Business Relationships

Every relationship below is sourced to a verbatim quote from a public company filing that names the counterparty, with a one-click link to the original document.

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7 customers3 competitors7 source filings

Featured in supply-chain maps: Semiconductor Foundries & Advanced Packaging

Customers (companies it supplies)

Supplies to → Credo

Filed 2026-06-15 · 21 days ago

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Supplies to → Cirrus Logic

Filed 2026-05-21 · 46 days ago

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”
— CRUS 10-K, filed 2026-05-21 · View source filing ↗

Supplies to → Astera Labs

Filed 2026-02-20 · 136 days ago

“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”
— ALAB 10-K, filed 2026-02-20 · View source filing ↗

Supplies to → Apple

Filed 2026-02-20 · 136 days ago

“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”
— AMKR 10-K, filed 2026-02-20 · View source filing ↗

Supplies to → Qualcomm

Last confirmed 2026-02-20 · 136 days ago · corroborated by 2 filings

“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”
— AMKR 10-K, filed 2026-02-20 · View source filing ↗

Supplies to → Lattice

Filed 2026-02-13 · 143 days ago

“We have qualified two major assembly partners, ASE and Amkor Technology ("Amkor") and are second sourced where volume and customer requirements make it necessary.”
— LSCC 10-K, filed 2026-02-13 · View source filing ↗

Supplies to → Broadcom

Filed 2025-12-18 · 200 days ago

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
— AVGO 10-K, filed 2025-12-18 · View source filing ↗

Competitors

Competes with ↔ ASE

Filed 2026-02-20 · 136 days ago

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”
— AMKR 10-K, filed 2026-02-20 · View source filing ↗

Competes with ↔ Jcet

Filed 2026-02-20 · 136 days ago

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”
— AMKR 10-K, filed 2026-02-20 · View source filing ↗

Competes with ↔ Powertech Technology

Filed 2026-02-20 · 136 days ago

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”
— AMKR 10-K, filed 2026-02-20 · View source filing ↗