TSMC — Supply Chain & Business Relationships

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K, filed 2026-02-11 · View source filing ↗

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K, filed 2026-05-21 · View source filing ↗

“In 2025, we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue.”

— TSM 20-F, filed 2026-04-16 · View source filing ↗

“For GaN products, our existing wafer fabrication partner is TSMC located in Taiwan.”

— NVTS 10-K, filed 2026-02-27 · View source filing ↗

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”

— ALAB 10-K, filed 2026-02-20 · View source filing ↗

“We partner with Taiwan Semiconductor Manufacturing Company ("TSMC") to develop and manufacture on 16nm technology, which is used in our Avant and Nexus 2 platforms of FPGA products, and to manufacture our 350nm, 130nm, 55nm and 40nm products.”

— LSCC 10-K, filed 2026-02-13 · View source filing ↗

“We currently partner primarily with Taiwan Semiconductor Manufacturing Co. (“TSMC”) and Semiconductor Manufacturing International Corporation (“SMIC”) to manufacture the majority of our semiconductor wafers.”

— SLAB 10-K, filed 2026-02-10 · View source filing ↗

“We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products”

— AMD 10-K, filed 2026-02-04 · View source filing ↗

“The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). … During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.”

— AVGO 10-K, filed 2025-12-18 · View source filing ↗

“We currently source more than half of our wafer requirements annually from third-party wafer fabrication foundries, such as Taiwan Semiconductor Manufacturing Company (TSMC) and others”

— ADI 10-K, filed 2025-11-25 · View source filing ↗

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K, filed 2025-11-05 · View source filing ↗

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K, filed 2025-08-08 · View source filing ↗

“In 2025, we had total purchases of NT$ 878 million (US$ 28 million) from VIS, representing 0.1% of our total cost of revenue.”

— TSM 20-F, filed 2026-04-16 · View source filing ↗

“In 2025, we had total purchases of NT$ 4,113 million (US$ 131 million) from SSMC, representing 0.3% of our total cost of revenue.”

— TSM 20-F, filed 2026-04-16 · View source filing ↗

“In 2025, we incurred total manufacturing expenses of NT$ 5,448 million (US$ 174 million) from Xintec, representing 0.4% of our total cost of revenue.”

— TSM 20-F, filed 2026-04-16 · View source filing ↗

“we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award”

— ASML 20-F, filed 2026-02-25 · View source filing ↗

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Taiwan Semiconductor Manufacturing Company Ltd. * * 10.4 % * * * * *”

— FORM 10-K, filed 2026-02-20 · View source filing ↗

“Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16%”

— ENTG 10-K, filed 2026-02-11 · View source filing ↗

“Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K, filed 2025-08-11 · View source filing ↗

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“In May 2026, SSS and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) entered into a non-binding memorandum of understanding to pursue a strategic partnership for the development and manufacturing of next-generation image sensors.”

— SONY 20-F, filed 2026-06-18 · View source filing ↗

“Since 1997, we have maintained a strategic alliance with TSMC, which designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”

— ASX 20-F, filed 2026-04-01 · View source filing ↗

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F, filed 2026-04-01 · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“including at one of our key foundry competitors, TSMC”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“In October 2024, we acquired additional shares in VIS’ capital increase transaction.”

— TSM 20-F, filed 2026-04-16 · View source filing ↗

“In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation services.”

— TSM 20-F, filed 2026-04-16 · View source filing ↗