UMC — Supply Chain & Business Relationships

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K, filed 2026-02-11 · View source filing ↗

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K, filed 2026-05-21 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We provide foundry services to these fabless design companies … Silicon Integrated Systems Corp.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We provide foundry services to these fabless design companies … Faraday Technology Corp.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“UMC licensed its 0.13um process technology to Hejian Technology (Suzhou) Co., Ltd.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“UMC licensed its 28nm process technology to United Semiconductor (Xiamen) Co., Ltd. … UMC licensed its 80/90nm process technology to United Semiconductor (Xiamen) Co., Ltd.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Lattice partners with United Microelectronics Corporation ("UMC") and its subsidiary United Semiconductor Japan Corporation ("USJC") to manufacture our products on its 130nm, 90nm, 65nm, and 40nm CMOS process technologies, as well as embedded flash memory in these process nodes.”

— LSCC 10-K, filed 2026-02-13 · View source filing ↗

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“On December 8, 2025, we announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate our silicon photonics roadmap.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we entered into a corporate power purchase agreement (“CPPA”) with Fengmiao I Offshore Wind Farm”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“IBM licensed its 20nm CMOS and FinFET technology to UMC”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“In addition, we partnered with Avalanche in 2018 for the joint development and production of MRAM, providing an alternative to embedded flash for 22nm technologies.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we currently have patent cross-licensing agreements with several companies, including International Business Machines Corporation, or IBM.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“In December 2025, we signed a MOU with Polar Semiconductor, LLC to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace and defense.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We and Cadence Design Systems collaborate on certification of analog/mixed-signal flow for 28HPC+ process.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“Other Intel Foundry competitors include GlobalFoundries, UMC and SMIC”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“Bargain purchase gain, which is derived from the acquisition of significant influence over SILICON INTEGRATED SYSTEMS CORP. (SIS).”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“On March 22, 2024, our board approved capital injection of up to NT$800 million in Faraday Technology Corp. to participate in its capital increase.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“On December 17, 2025, our board approved capital injection of up to NT$700 million in Unimicron Technology Corp. to participate in its capital increase.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗