力成科技(Powertech Technology) — 供應鏈與商業關係
下方的每一段關係都源自公開公司申報文件中的逐字引用,點名了交易對手,並附有一鍵連結至原始文件。
點擊公司開啟其地圖 · 拖曳探索 · 游標懸停連線可閱讀來源引文。綠=供應 · 橘虛線=競爭 · 藍=合作 · 紫=持股 · 灰虛線=暫停 · 如何閱讀這些資料。
在完整地圖中查看 力成科技(Powertech Technology) →
16 家供應商1 家客戶1 家競爭對手2 份來源申報文件
客戶(其供應的公司)
供應給 →
Micron
申報於 2026-05-27 · 96 天前
“the Company signed a contract on semiconductor manufacturing investment with Micron Technology Inc., one of our key customers.”Powertech Technology 與其關鍵客戶 Micron 簽訂半導體製造投資合約。(以原文為準)
供應商(供應其產品或服務的公司)
供應來自 ←
Chang Wah Technology
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Chang Wah Technology Corp.”Powertech Technology 將 Chang Wah Technology 列為其封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Nichiden Seimitu Kogyo
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Nichiden Seimitu Kogyo Co., Ltd.”Powertech Technology 將 Nichiden Seimitu Kogyo 列為封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Kinsus
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Kinsus Interconnect Technology Corp.”Powertech Technology 將 Kinsus 列為其封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Simmtech
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Simmtech Co., Ltd.”Powertech Technology 將 Simmtech 列為封裝關鍵原物料供應商。(以原文為準)
供應來自 ←
Samsung Electro-Mechanics
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Samsung Electro-Mechanics Co.”Powertech Technology 將 Samsung Electro-Mechanics 列為封裝作業關鍵原物料供應商之一。(以原文為準)
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Leading Interconnect Semiconductor Technology Co., Ltd.”Powertech Technology 將 Leading Interconnect Semiconductor Technology 列為封裝關鍵原物料供應商。(以原文為準)
供應來自 ←
Nitto Denko
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Nitto Denko Corp.”Powertech Technology 將 Nitto Denko 列為封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Lintec
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … LINTEC Corp.”Powertech Technology 將 Lintec 列為其封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Henkel Korea
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Henkel Korea”Powertech Technology 將 Henkel Korea 列為封裝關鍵原物料供應商。(以原文為準)
供應來自 ←
Tanaka Kikinzoku Kogyo K K
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … TANAKA Kikinzoku Kogyo K.K.”Powertech Technology 將 Tanaka Kikinzoku Kogyo K K 列為封裝關鍵原物料供應商。(以原文為準)
供應來自 ←
Chao Young
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Chao Young Corp.”Powertech Technology 將 Chao Young 列為其封裝作業關鍵原物料供應商之一。(以原文為準)
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Resonac Semiconductor Materials (Taiwan) Co., Ltd”Powertech Technology 將 Resonac Semiconductor Materials Taiwan 列為其封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Kyocera Asia Pacific
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … KYOCERA Asia-Pacific Pte. Ltd.”Powertech Technology 將 Kyocera Asia Pacific 列為封裝關鍵原物料供應商。(以原文為準)
供應來自 ←
Shinko Electric Ind
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Shinko Electric Ind. Co., Ltd.”Powertech Technology 將 Shinko Electric Ind 列為其封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Phoenix Pioneer Technology
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Phoenix Pioneer Technology Inc.”Powertech Technology 將 Phoenix Pioneer Technology 列為封裝作業關鍵原物料供應商之一。(以原文為準)
供應來自 ←
Nippon Micrometal
申報於 2026-05-27 · 96 天前
“The suppliers of the key raw materials used in packaging operations are listed below: … Nippon Micrometal Corp.”Powertech Technology 將 Nippon Micrometal 列為其封裝作業關鍵原物料供應商之一。(以原文為準)
競爭對手
相互競爭 ↔
Amkor
申報於 2026-02-20 · 192 天前
“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”— AMKR 10-K,申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗Amkor 面臨來自 Powertech Technology 等封測服務提供者的競爭。(以原文為準)