Rambus — 供應鏈與商業關係
下方的每一段關係都源自公開公司申報文件中的逐字引用，點名了交易對手，並附有一鍵連結至原始文件。
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23 家客戶8 家競爭對手3 份來源申報文件
收錄於供應鏈主題地圖：AI 資料中心運算與互連
客戶（其供應的公司）
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AMD
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 AMD 列為已取得 Rambus 專利授權的公司之一。（以原文為準）
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Amlogic
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 Amlogic 列為已取得 Rambus 專利授權的公司之一。（以原文為準）
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Broadcom
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Broadcom 等公司已取得 Rambus 的專利授權。（以原文為準）
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Changxin Memory
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 Changxin Memory 列為已取得 Rambus 專利授權的公司之一。（以原文為準）
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IBM
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 IBM 列為已取得 Rambus 專利授權的公司之一。（以原文為準）
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Infineon
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Infineon 等公司已取得 Rambus 的專利授權。（以原文為準）
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Kioxia
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Kioxia 是已取得 Rambus 專利授權的公司之一。（以原文為準）
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Marvell
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 指出 Marvell 等公司已取得其專利授權。（以原文為準）
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MediaTek
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗MediaTek 是 Rambus 的專利授權客戶之一。（以原文為準）
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Micron
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Micron 等公司已取得 Rambus 的專利授權。（以原文為準）
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Nanya
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Nanya 已取得 Rambus 的專利授權。（以原文為準）
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Nuvoton
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 的專利已授權給 Nuvoton 等多家公司。（以原文為準）
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NVIDIA
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗NVIDIA 等公司已取得 Rambus 的專利授權。（以原文為準）
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Phison
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 Phison 列為已取得 Rambus 專利授權的公司之一。（以原文為準）
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Qualcomm
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Qualcomm 已取得 Rambus 的專利授權。（以原文為準）
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Samsung
申報於 2026-02-18 · 194 天前
“Our memory interface chips are sold to major DRAM manufacturers, Micron, Samsung and SK hynix”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 Samsung 列為其記憶體介面晶片的主要銷售對象之一。（以原文為準）
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Silicon Motion Technology 是 Rambus 的專利授權對象之一。（以原文為準）
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SK Hynix
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗SK Hynix 已獲得 Rambus 的專利授權。（以原文為準）
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Socionext
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Socionext 已取得 Rambus 的專利授權。（以原文為準）
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STMicroelectronics
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 STMicroelectronics 列為已取得 Rambus 專利授權的公司之一。（以原文為準）
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Toshiba
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Toshiba 等公司已取得 Rambus 的專利授權。（以原文為準）
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WDC
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗WDC（Western Digital）已取得 Rambus 的專利授權。（以原文為準）
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Winbond
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 將 Winbond 列為已取得 Rambus 專利授權的公司之一。（以原文為準）
競爭對手
相互競爭 ↔
Marvell
申報於 2026-03-11 · 173 天前
“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗Rambus 是 Marvell 的直接競爭者之一。（以原文為準）
相互競爭 ↔
Astera Labs
申報於 2026-02-20 · 192 天前
“Our principal competitors include Broadcom, Inc., Credo Technology Group Holding Ltd., Marvell Technology, Inc., Microchip Technology Inc., Montage Technology, Parade Technologies, Ltd., and Rambus, Inc.”— ALAB 10-K，申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗Astera Labs 將 Rambus 列為其主要競爭對手之一。（以原文為準）
相互競爭 ↔
Monolithic Power
申報於 2026-02-18 · 194 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Monolithic Power 在記憶體介面晶片市場與 Rambus 等國際半導體公司競爭。（以原文為準）
相互競爭 ↔
Montage Technology
申報於 2026-02-18 · 194 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Montage Technology 是 Rambus 在記憶體介面晶片市場的競爭對手之一。（以原文為準）
相互競爭 ↔
Renesas
申報於 2026-02-18 · 194 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗在記憶體介面晶片市場，Rambus 的競爭對手包括 Renesas。（以原文為準）
相互競爭 ↔
Texas Instruments
申報於 2026-02-18 · 194 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Rambus 在記憶體介面晶片市場與 Texas Instruments 等國際半導體公司競爭。（以原文為準）
相互競爭 ↔
Cadence
申報於 2026-02-18 · 194 天前
“In the Silicon IP market, Rambus competes with the in-house design teams at our potential customers, as well as with third-party IP suppliers, such as Cadence and Synopsys.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗在矽智財市場，Rambus 與 Cadence 是競爭對手。（以原文為準）
相互競爭 ↔
Synopsys
申報於 2026-02-18 · 194 天前
“In the Silicon IP market, Rambus competes with the in-house design teams at our potential customers, as well as with third-party IP suppliers, such as Cadence and Synopsys.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗在矽智財市場，Rambus 的競爭對手包括 Synopsys。（以原文為準）
公司公告
Rambus 自身的申報／公告，取自本站檔案：美國 SEC 財報申報（8-K Item 2.02 與 6-K 業績報告）自 2025-07-22 起，另含涵蓋範圍內的台灣證券交易所重大訊息。並非完整申報歷史；主旨一律以原文原樣呈現。
• Record quarterly revenue of $207.4 million, up 20% year over year, exceeding revenue guidance range • GAAP diluted earnings per share of $0.61 and non-GAAP diluted earnings per share of $0.77, exceeding non-GAAP diluted earnings per share guidance range • Record product revenue of $99.2 million, up 13% quarter over quarter and 22% year over year（申報原文節錄，以原文為準）顯示更多原文
• Expanded product and IP offerings for next-generation AI systems, including complete chipsets for DDR5 9600 server and client memory modules, and PCIe 7 Switch IP SAN JOSE, Calif. – July 27, 2026 – Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the second quarter ended June 30, 2026. Total revenue for the second quarter was $207.4 million, product revenue was $99.2 million, royalties revenue was $84.2 million and contract and other revenue was $24.0 million. GAAP diluted earnings per share was $0.61 and non-GAAP diluted earnings per share was $0.77. The Company also generated $61.2 million in cash from operating activities in the second quarter.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
• Achieved strong Q1 results, delivering quarterly product revenue of $88.0 million, up 15% year over year • Generated strong quarterly cash from operations of $83.2 million • Expanded product and IP offerings for next-generation AI platforms, including the LPDDR5X SOCAMM2 server module chipset, the industry’s fastest HBM4E memory controller IP SAN JOSE, Calif. – April 27, 2026 – Rambus Inc.（申報原文節錄，以原文為準）顯示更多原文
(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the first quarter ended March 31, 2026. GAAP revenue for the first quarter was $180.2 million, licensing billings were $70.8 million, product revenue was $88.0 million, and contract and other revenue was $22.6 million. The Company also generated $83.2 million in cash from operating activities in the first quarter. “Rambus opened 2026 with a solid first quarter, delivering financial results in line with guidance and generating strong cash from operations,” said Luc Seraphin, president and chief executive officer of Rambus.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
• Achieved record 2025 revenue and earnings results • Delivered record quarterly product revenue of $96.8 million, fueling record annual product revenue of $347.8 million, up 41% from 2024 • Generated record quarterly and annual cash from operations of $99.8 million and $360.0 million, respectively SAN JOSE, Calif. – February 2, 2026 – Rambus Inc.（申報原文節錄，以原文為準）顯示更多原文
(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the fourth quarter ended December 31, 2025. GAAP revenue for the fourth quarter was $190.2 million, licensing billings were $71.5 million, product revenue was $96.8 million, and contract and other revenue was $21.8 million. The Company also generated $99.8 million in cash from operating activities in the fourth quarter. “2025 was a record-breaking year for Rambus, delivering strong growth in revenue and earnings, and new quarterly and annual highs for product revenue and cash from operations,” said Luc Seraphin, president and chief executive officer of Rambus. “Our sustained leadership in DDR5 RCDs and growing contributions from new products drove substantial year-over-year product growth.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
• Delivered very strong Q3 results and generated excellent quarterly cash from operations of $88.4 million • Achieved fourth consecutive quarterly product revenue record at $93.3 million SAN JOSE, Calif. – October 27, 2025 – Rambus Inc.（申報原文節錄，以原文為準）顯示更多原文
(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the third quarter ended September 30, 2025. GAAP revenue for the third quarter was $178.5 million, licensing billings were $66.1 million, product revenue was $93.3 million, and contract and other revenue was $20.1 million. The Company also generated $88.4 million in cash from operating activities in the third quarter. “Rambus delivered a very strong third quarter, with record product revenue and excellent cash from operations, while continuing to execute on our strategic roadmap,” said Luc Seraphin, president and chief executive officer of Rambus. “Sustained DDR5 product leadership and ramping contributions from new products put us on track to deliver full-year product revenue growth that outpaces the market.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
• Exceeded expectations for Q2 revenue and earnings • Achieved record quarterly product revenue of $81.3 million, up 43% year over year • Generated record quarterly cash from operations of $94.4 million SAN JOSE, Calif. – July 28, 2025 – Rambus Inc.（申報原文節錄，以原文為準）顯示更多原文
(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the second quarter ended June 30, 2025. GAAP revenue for the second quarter was $172.2 million, licensing billings were $66.4 million, product revenue was $81.3 million, and contract and other revenue was $22.3 million. The Company also generated $94.4 million in cash provided by operating activities in the second quarter. “Rambus delivered a very strong Q2, with record product revenue and record cash generation reflecting the strength of our business model and execution,” said Luc Seraphin, president and chief executive officer of Rambus. “Our chip business continues to be a key growth engine for the company.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗