Qualcomm — 供應鏈與商業關係
下方的每一段關係都源自公開公司申報文件中的逐字引用，點名了交易對手，並附有一鍵連結至原始文件。
點擊公司開啟其地圖 · 拖曳探索 · 游標懸停連線可閱讀來源引文。綠＝供應 · 橘虛線＝競爭 · 藍＝合作 · 紫＝持股 · 灰虛線＝暫停 · 如何閱讀這些資料。
9 家供應商5 家客戶1 家合作夥伴16 家競爭對手16 份來源申報文件
收錄於供應鏈主題地圖：網路與連線晶片
客戶（其供應的公司）
申報於 2025-11-05 · 299 天前
“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗在 2025 會計年度，來自 Samsung 的收入佔 Qualcomm 合併營收 10%以上。（以原文為準）
申報於 2025-11-05 · 299 天前
“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Xiaomi 在 2025 會計年度佔 Qualcomm 合併營收的 10%或以上。（以原文為準）
供應給 →
Pegatron
申報於 2026-05-28 · 95 天前
“Develop a full‑feature AI smart‑glasses system that is dust‑proof and waterproof, uses a Qualcomm AR1 Gen1 SOC and RT595 MCU with 64 GB storage, and includes prescription corrective lenses.”Pegatron 在其開發的 AI 智慧眼鏡系統中採用 Qualcomm AR1 Gen1 處理器。（以原文為準）
供應給 →
Apple
申報於 2025-11-05 · 299 天前
“Apple purchases our MDM (or thin modem) products”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Apple 向 Qualcomm 購買 MDM（或精簡數據機）產品。（以原文為準）
供應給 →
Transsion
申報於 2025-11-05 · 299 天前
“During the second quarter of fiscal 2025, we executed final agreements for new long-term licenses with two key Chinese OEMs (for which the initial terms had expired) and entered into comprehensive 4G and 5G license agreements with Transsion (a growing, China-headquartered OEM”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 與 Transsion 簽訂了全面的 4G 和 5G 授權協議。（以原文為準）
供應商（供應其產品或服務的公司）
申報於 2026-05-26 · 97 天前
“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”— ARM 20-F，申報於 2026-05-26 EDGAR · 查看原始申報文件 ↗Qualcomm 是 Arm 的主要客戶，在截至 2026 年 3 月 31 日的財年佔 Arm 總營收的 9%。（以原文為準）
供應來自 ←
Amkor
最近確認於 2026-02-20 · 192 天前 · 經 2 份申報文件佐證
“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”— AMKR 10-K，申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗截至 2025 年 12 月 31 日止年度，Amkor 對 Qualcomm 的直接銷售佔其淨銷售額的 11.1%。（以原文為準）
供應來自 ←
Rambus
申報於 2026-02-18 · 194 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗Qualcomm 已取得 Rambus 的專利授權。（以原文為準）
供應來自 ←
TSMC
申報於 2025-11-05 · 299 天前
“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 的主要晶圓代工供應商包括 TSMC。（以原文為準）
供應來自 ←
Samsung
申報於 2025-11-05 · 299 天前
“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 之主要晶圓代工供應商包括 Samsung。（以原文為準）
供應來自 ←
GlobalFoundries
申報於 2025-11-05 · 299 天前
“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗GlobalFoundries 是 Qualcomm 的晶圓代工供應商之一。（以原文為準）
供應來自 ←
ASE
申報於 2025-11-05 · 299 天前
“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 的主要半導體組裝和測試供應商包括 ASE。（以原文為準）
供應來自 ←
SPIL
申報於 2025-11-05 · 299 天前
“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 的主要半導體封測供應商包括 SPIL。（以原文為準）
供應來自 ←
STATS ChipPAC
申報於 2025-11-05 · 299 天前
“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 將 Advanced Semiconductor Engineering、Amkor Technology、Siliconware Precision Industries 及 STATS ChipPAC 列為其主要半導體封裝與測試供應商。（以原文為準）
合作夥伴與協作
合作夥伴 ↔
STMicroelectronics
申報於 2026-02-26 · 186 天前
“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗Qualcomm 與 STMicroelectronics 於 2024 年宣布合作推出首款產品，旨在簡化搭載 STM32 MCU 的系統中無線連接的實現。（以原文為準）
競爭對手
相互競爭 ↔
Cirrus Logic
申報於 2026-05-21 · 102 天前
“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”— CRUS 10-K，申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗Cirrus Logic 的主要競爭對手包括 Qualcomm。（以原文為準）
相互競爭 ↔
Qorvo
最近確認於 2026-05-08 · 115 天前 · 經 2 份申報文件佐證
“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗Qorvo 的 CSG 與 ACG 業務均與 Qualcomm 競爭。（以原文為準）
相互競爭 ↔
Marvell
申報於 2026-03-11 · 173 天前
“Companies that compete directly with our businesses include, but are not limited to, … Qualcomm Incorporated (“Qualcomm”)”— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗Marvell 將 Qualcomm 列為直接競爭對手之一。（以原文為準）
相互競爭 ↔
NVIDIA
最近確認於 2026-02-25 · 187 天前 · 經 2 份申報文件佐證
“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”— NVDA 10-K，申報於 2026-02-25 EDGAR · 查看原始申報文件 ↗NVIDIA 的競爭對手包括 Qualcomm 等公司。（以原文為準）
相互競爭 ↔
NXP
最近確認於 2026-02-19 · 193 天前 · 經 2 份申報文件佐證
“Our primary key public competitors in alphabetical order include, but are not limited to, Analog Devices Inc., Broadcom Inc., Infineon Technologies AG, Microchip Technology Inc., Qualcomm Inc., Renesas Electronics Corp., STMicroelectronics NV and Texas Instruments Inc.”— NXPI 10-K，申報於 2026-02-19 EDGAR · 查看原始申報文件 ↗NXP 的主要公開競爭對手包括 Qualcomm。（以原文為準）
相互競爭 ↔
Silicon Labs
申報於 2026-02-10 · 202 天前
“We compete with Espressif, Infineon, MediaTek, Microchip, Nordic Semiconductor, NXP, Qualcomm, Renesas, STMicroelectronics, Synaptics, Telink, Texas Instruments and others.”— SLAB 10-K，申報於 2026-02-10 EDGAR · 查看原始申報文件 ↗Silicon Labs 與 Qualcomm 互為競爭者。（以原文為準）
相互競爭 ↔
AMD
申報於 2026-02-04 · 208 天前
“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗AMD 預期與 Qualcomm 在 ASSP 領域持續競爭。（以原文為準）
相互競爭 ↔
Intel
申報於 2026-01-23 · 220 天前
“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗Intel 面臨來自 Qualcomm 等公司基於 ARM 架構處理器的競爭。（以原文為準）
相互競爭 ↔
Skyworks
最近確認於 2025-11-07 · 297 天前 · 經 2 份申報文件佐證
“Our competitors include … Qualcomm,”— SWKS 10-K，申報於 2025-11-07 EDGAR · 查看原始申報文件 ↗Qualcomm 是 Skyworks 的競爭對手之一。（以原文為準）
相互競爭 ↔
Broadcom
申報於 2025-11-05 · 299 天前
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Broadcom 與 Qualcomm 在提供裝置端 AI、高效能低功耗運算及無線連接 IC 產品/軟體方面是競爭對手或潛在競爭對手。（以原文為準）
相互競爭 ↔
Hisilicon
申報於 2025-11-05 · 299 天前
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗HiSilicon 是 Qualcomm 在提供裝置端 AI、高效能低功耗運算及無線連接積體電路產品領域的競爭對手或潛在競爭對手之一。（以原文為準）
相互競爭 ↔
MediaTek
申報於 2025-11-05 · 299 天前
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗MediaTek 是 Qualcomm 在裝置端 AI 與高效能運算晶片領域的競爭者之一。（以原文為準）
相互競爭 ↔
Mobileye
申報於 2025-11-05 · 299 天前
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Mobileye 與 Qualcomm 在裝置端 AI 等領域是競爭者或潛在競爭者。（以原文為準）
相互競爭 ↔
Samsung
申報於 2025-11-05 · 299 天前
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 將 Samsung 列為其競爭對手或潛在競爭對手之一。（以原文為準）
相互競爭 ↔
Texas Instruments
申報於 2025-11-05 · 299 天前
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 將 Texas Instruments 列為其競爭者或潛在競爭者之一。（以原文為準）
相互競爭 ↔
Unisoc
申報於 2025-11-05 · 299 天前
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗Qualcomm 將 Unisoc 列為其競爭對手或潛在競爭對手之一。（以原文為準）
公司公告
Qualcomm 自身的申報／公告，取自本站檔案：美國 SEC 財報申報（8-K Item 2.02 與 6-K 業績報告）自 2025-07-22 起，另含涵蓋範圍內的台灣證券交易所重大訊息。並非完整申報歷史；主旨一律以原文原樣呈現。
Revenues: $9.9 billion GAAP EPS: $1.87, Non-GAAP EPS: $2.21 —Combined QCT Automotive and IoT Revenues Grew 28% Year-Over-Year— —QCT Automotive Revenues: 23 Consecutive Quarters of Double-Digit Year-Over-Year Growth— —Completed Acquisition of Modular Inc Creating an Open Software Foundation for Generative and Agentic AI— SAN DIEGO - July 29, 2026 - Qualcomm Incorporated (NASDAQ: QCOM) today（申報原文節錄，以原文為準）顯示更多原文
announced results for its fiscal third quarter ended June 28, 2026. “Despite a challenging memory and supply environment, our third quarter results reflect solid execution of our growth strategy, with quarterly revenues at the high end of guidance,” said Cristiano Amon, President and CEO of Qualcomm Incorporated. “We are well positioned to execute on the vision we outlined at our recent Investor Day, with total non-handset revenues growing to $40 billion by fiscal 2029 – nearly double the target we shared in November 2024.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
Revenues: $10.6 billion GAAP EPS: $6.88, Non-GAAP EPS: $2.65 —Record Quarterly QCT Automotive Revenues— —Diversification: Combined QCT Automotive and IoT Revenues Grew 20% Year-Over-Year— —Completed $5.4B of Share Repurchases in First Half of Fiscal 2026 and Announced New $20B Authorization— SAN DIEGO - April 29, 2026 - Qualcomm Incorporated (NASDAQ: QCOM) today announced results for its fiscal（申報原文節錄，以原文為準）顯示更多原文
second quarter ended March 29, 2026. “We are pleased to deliver results in line with our guidance, reflecting solid execution as we navigate a challenging memory environment,” said Cristiano Amon, President and CEO of Qualcomm Incorporated. “We are in a period of profound industry transformation — the rise of AI agents is reshaping our roadmap across every platform we develop. We are equally excited by our entry into the data center, where a leading hyperscaler custom silicon engagement is on track for initial shipments later this calendar year.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
Record Revenues: $12.3 billion GAAP EPS: $2.78, Non-GAAP EPS: $3.50 —Record Quarterly Total Company and QCT Revenues— —Record QCT Automotive Revenues: 2nd Consecutive Quarter of Greater Than $1 Billion— —Completed Acquisition of Alphawave Semi Accelerating Our Expansion into Data Centers— SAN DIEGO - February 4, 2026 - Qualcomm Incorporated (NASDAQ: QCOM) today announced results for its fiscal（申報原文節錄，以原文為準）顯示更多原文
first quarter ended December 28, 2025. “We are pleased to deliver strong quarterly results, with record total company revenues,” said Cristiano Amon, President and CEO of Qualcomm Incorporated. “Our momentum across personal, industrial and physical AI is growing, as evidenced by recent product announcements at CES and customer traction.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
GAAP Revenues: $44.3 billion Fiscal 2025 GAAP EPS: $5.01, Non-GAAP EPS: $12.03 —QCT: Record Fiscal Year Revenues - Executing Towards our 2024 Investor Day Targets— —Total QCT Non-Apple Fiscal Year Revenues Grew 18% Year-Over-Year— —Combined QCT Automotive and IoT Fiscal Year Revenues Grew 27% Year-Over-Year— SAN DIEGO - November 5, 2025 - Qualcomm Incorporated (NASDAQ: QCOM) today announced（申報原文節錄，以原文為準）顯示更多原文
results for its fiscal fourth quarter and year ended September 28, 2025. "Our business remains strong as demonstrated by record QCT revenues in fiscal 2025,” said Cristiano Amon, President and CEO of Qualcomm Incorporated. “We delivered 18% year-over-year growth in total QCT non‑Apple revenues, with combined fiscal year Automotive and IoT revenue growth of 27%.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
Revenues: $10.4 billion GAAP EPS: $2.43, Non-GAAP EPS: $2.77 —QCT Diversification: Combined Automotive and IoT Revenues Grew 23% Year-Over-Year— —QCT Automotive: Record Quarterly Revenues— —On track to meet our accelerated buyback commitment in FY25— SAN DIEGO - July 30, 2025 - Qualcomm Incorporated (NASDAQ: QCOM) today announced results for its fiscal third quarter ended June 29, 2025.（申報原文節錄，以原文為準）顯示更多原文
“Another quarter of strong growth in QCT Automotive and IoT revenues further validates our diversification strategy and confidence in achieving our long-term revenue targets,” said Cristiano Amon, President and CEO of Qualcomm Incorporated.
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗