Intel — 供應鏈與商業關係

“Vector Core Compute (VC2) unveiled a disaggregated agentic cloud combining Intel® Xeon® processors, SambaNova RDUs and NVIDIA Blackwell GPUs”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 的 Xeon 處理器獲 Vector Core Compute 採用於其雲端方案。（以原文為準）

“Intel expanded its purpose-built silicon business beyond networking and IPUs through a strategic collaboration with Fortinet to develop Fortinet Security Processor 6 using Intel's advanced design, packaging and manufacturing capabilities.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 與 Fortinet 策略合作，使用 Intel 的先進設計、封裝與製造能力開發 Fortinet Security Processor 6。（以原文為準）

“Primary source of supply Primary source of supply Status Stable Stable Stable Stable Stable Stable Stable Stable Stable Stable INTEL NVIDIA AMD HP-SINGAPO SK Hynix WT MICROELECTRONICS CO., LTD WORLD PEACE INDUSTRIAL CO., LTD Supreme Electronics Co., Ltd. Promate Electronic Co., Ltd. Weikeng Industrial Co., Ltd.”

— Gigabyte Technology Annual report，申報於 2026-06-09 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Gigabyte Technology 將 Intel 列為主要供應來源之一。（以原文為準）

“Consumer systems (laptops, 2‑in‑1s, and Mini PCs) are primarily designed on Intel Panther Lake, Lunar Lake, Arrow Lake, Raptor Lake Refresh, Twin Lake, AMD Ryzen AI series, and ARM‑based CPU platforms, and support next‑generation operating systems.”

— Pegatron Annual report，申報於 2026-05-28 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Pegatron 在其消費性系統產品設計中採用 Intel 處理器平台。（以原文為準）

“Intel Xeon 6 was selected as the host CPU for NVIDIA’s DGX Rubin NVL8 systems, reinforcing Intel’s continued role at the center of leading AI infrastructure deployments.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

Intel Xeon 6 被選為 NVIDIA DGX Rubin NVL8 系統的主機 CPU，強化了 Intel 在領先 AI 基礎設施部署中的持續角色。（以原文為準）

“We provide semiconductor wafer manufacturing services to Altera, a related party, in accordance with a wafer manufacturing and sale agreement.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 根據晶圓製造與銷售協議，向關聯方 Altera 提供半導體晶圓製造服務。（以原文為準）

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 依賴 ASML 作為 EUV 微影設備之獨家供應商。（以原文為準）

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 部分最先進的現有及未來產品將由 TSMC 獨家製造或依賴其關鍵元件。（以原文為準）

“IP revenue grew more than 40% year-over-year, driven by strong demand for Cadence’s Star IP portfolio, highlighted by a significant agreement with Intel and additional wins with leading semiconductor companies”

— CDNS 8-K，申報於 2026-07-27 EDGAR · 查看原始申報文件 ↗

Cadence 表示其 IP 營收成長得益於與 Intel 之重大協議及對其 Star IP 之強勁需求。（以原文為準）

“Received a 2026 Intel EPIC Supplier Award for Excellence in Technology Development.”

— AMAT 8-K，申報於 2026-05-14 EDGAR · 查看原始申報文件 ↗

Applied Materials 獲得 Intel 頒發的 2026 年 Intel EPIC 供應商卓越技術開發獎。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗

Intel 是 UMC 的主要客戶之一，屬於整合元件製造商。（以原文為準）

“主な相手先別の販売実績及び当該販売実績の総販売実績に対する割合は、次のとおりです。 … Intel Corp. 76,709 20.8 75,319 18.1”

— Ibiden Co., Ltd. Annual securities report，申報於 2026-03-31 EDINET (日本法定有價證券報告書；引文為日文原文) · 查看原始申報文件 ↗

Ibiden 將 Intel 列為主要客戶，對其銷售額如原文表格所示，前期佔 20.8% 及本期佔 18.1%。（以原文為準）

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Intel Corporation * * 12.4 % 12.0 % * 17.1 % 16.7 % 15.7 %”

— FORM 10-K，申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗

Intel 在特定季度佔 FormFactor 季度營收 10% 以上，如原文表格所示。（以原文為準）

“our total solutions strategy is gaining traction, and we are seeing increasing BOM content on new platforms such as Intel’s Panther Lake”

— AOSL 8-K，申報於 2026-02-05 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 在 Intel 的 Panther Lake 等新平台上看到 BOM 內容增加。（以原文為準）

“2025 waren unsere drei größten Kunden, in alphabetischer Reihenfolge, Intel Corporation, Samsung Electronics und Taiwan Semiconductor Manufacturing Company (TSMC).”

— Siltronic AG Annual report (Geschäftsbericht)，申報於 2025-12-31 (德國法定年度報告；引文為德文原文) · 查看原始申報文件 ↗

Siltronic 將 Intel 列為 2025 年三大客戶之一。（以原文為準）

“当連結会計年度及び前連結会計年度における主な相手先別の販売実績及び当該販売実績の総販売実績に対する 割合は次のとおりであります。 … Intel Corporation”

— Lasertec Corporation Annual securities report，申報於 2025-06-30 EDINET (日本法定有價證券報告書；引文為日文原文) · 查看原始申報文件 ↗

Lasertec 將 Intel 列為主要客戶，揭露其銷售實績及佔總銷售實績之比例。（以原文為準）

“Our customers are primarily leading multinational chip manufacturers, foundries, assembly subcontractors and electronics and industrial companies and include Amkor, ASE, Foxconn, Infineon, InnoLight, Intel, LG Innotek, Micron, Nvidia, NXP, STMicroelectronics, Texas Instruments and TSMC.”

— BE Semiconductor Industries N.V. Annual report (ESEF)，申報於 2024-12-31 ESEF · 查看原始申報文件 ↗

Besi 將 Intel 列為其客戶。（以原文為準）

“Intel and Google announced a multiyear collaboration for continued deployment of Intel ® Xeon ® processors across Google’s workload-optimized instances, including the latest Intel ® Xeon ® 6 processors powering C4 and N4 instances. … The collaboration also includes co-development of custom ASIC infrastructure processing units (IPUs) designed to improve utilization, reduce complexity, and scale AI workloads more efficiently.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

Intel 與 Google/Alphabet 宣布多年合作，持續在 Google 的工作負載最佳化實例中部署 Intel Xeon 處理器，並共同開發客製化 ASIC 基礎設施處理單元。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Siemens 列為共同開發產業特定 AI 與運算解決方案之策略合作夥伴。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Hitachi 建立策略合作，共同開發由 Intel 處理器及專用晶片驅動的產業特定 AI 與運算解決方案。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Echo Neurotechnologies 建立策略合作，共同開發由 Intel 處理器及專用晶片驅動的產業特定 AI 與運算解決方案。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Greenstone Biosciences 列為共同開發 AI 與運算解決方案之策略合作夥伴。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Foxconn 建立策略合作關係，共同開發由 Intel 處理器驅動的產業特定人工智慧與運算解決方案。（以原文為準）

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F，申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗

Intel 與 UMC 合作，共同開發新的 12nm 半導體製程平台。（以原文為準）

“Announced a collaboration with Intel to jointly develop multiple generations of custom data center and PC products with NVIDIA NVLink.”

— NVDA 8-K，申報於 2025-11-19 EDGAR · 查看原始申報文件 ↗

NVIDIA 宣布與 Intel 合作，共同開發多代客製化資料中心與 PC 產品，並採用 NVIDIA NVLink。（以原文為準）

“GIGABYTE has formed strategic partnerships with major suppliers such as Intel, AMD, and NVIDIA”

— Gigabyte Technology Annual report，申報於 2026-06-09 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Gigabyte Technology 已與 Intel 等主要供應商建立策略夥伴關係。（以原文為準）

“The Company continues to deepen cooperation with AMD, Intel, and NVIDIA”

— Chenbro Micom Annual report，申報於 2026-05-29 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Chenbro Micom 持續深化與 Intel 的合作。（以原文為準）

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report，申報於 2026-05-25 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Faraday Technology 將 Intel 列為策略聯盟夥伴。（以原文為準）

“Intel and SambaNova announced the blueprint for a heterogeneous hardware solution, addressing performance, efficiency, and software compatibility challenges facing enterprises and cloud providers.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

Intel 與 SambaNova Systems 宣布異質硬體解決方案的藍圖。（以原文為準）

“Intel joined the Terafab project as a strategic partner alongside SpaceX, xAI, and Tesla.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

INTC（Intel）以策略合作夥伴身分加入 Terafab 專案，合作夥伴包括 SpaceX、xAI 及 Tesla。（以原文為準）

“Intel joined the Terafab project as a strategic partner alongside SpaceX, xAI, and Tesla.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

INTC 指出 Intel 與 xAI 等公司一同加入 Terafab 專案成為策略合作夥伴。（以原文為準）

“Intel joined the Terafab project as a strategic partner alongside SpaceX, xAI, and Tesla.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

Intel 以策略合作夥伴身分加入 Terafab 專案，與 Tesla 等公司並列。（以原文為準）

“Intel and Cisco announced a collaboration on an integrated platform for distributed AI workloads.”

— INTC 8-K，申報於 2026-01-22 EDGAR · 查看原始申報文件 ↗

Intel 與 Cisco 宣布合作開發分散式 AI 工作負載的整合平台。（以原文為準）

“Intel Foundry and ASML have demonstrated technical viability of the most advanced lithography scanner available in delivering improved accuracy and productivity that positions High Numerical Aperture (High NA) EUV for future high-volume manufacturing.”

— INTC 8-K，申報於 2026-01-22 EDGAR · 查看原始申報文件 ↗

INTC（Intel Foundry）與 ASML 已展示最先進微影掃描器在提升精度與生產力方面的技術可行性，使 High NA EUV 適用於未來大量生產。（以原文為準）

“Intel advanced its relationship with Microsoft through a collaboration with Windows ML and the integration of Intel vPro® manageability with Microsoft Intune.”

— INTC 8-K，申報於 2025-10-23 EDGAR · 查看原始申報文件 ↗

Intel 透過與 Windows ML 之合作及 Intel vPro® 管理性與 Microsoft Intune 之整合，深化其與 Microsoft 之關係。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Intel 是 Marvell 的直接競爭對手之一。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 亦與部分 IDM 的晶圓代工服務競爭，例如 Intel 及 Samsung 等公司。（以原文為準）

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K，申報於 2026-02-25 EDGAR · 查看原始申報文件 ↗

NVIDIA 將 Intel 列為當前競爭對手之一。（以原文為準）

“Our primary competitor in the supply of CPUs and APUs is Intel.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

Intel 是 AMD 在 CPU 和 APU 供應上的主要競爭者。（以原文為準）

“As we pursue our strategy to establish Intel Foundry as a major provider of foundry capacity to manufacture semiconductors for others, we face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries, UMC and SMIC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 將 TSMC 列為晶圓代工領域的競爭對手。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 面臨來自採用 ARM 架構設計處理器之公司的競爭，例如 Apple 及其 M 系列產品。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 面臨來自 Qualcomm 等公司基於 ARM 架構處理器的競爭。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 面臨來自 MediaTek（以其 Kompanio 產品）的顯著競爭。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Amazon 等多家超大規模業者正在開發自有客製化晶片，與 Intel 形成競爭。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Meta 列為自行開發客製化晶片的公司之一，與 Amazon、Google、Microsoft 等超大型雲端業者並列。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 與 Microsoft 在客製化晶片開發方面是競爭對手。（以原文為準）

“We also compete with Broadcom in the custom ASICs development market”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 在客製化 ASIC 開發市場與 Broadcom 競爭。（以原文為準）

“As we pursue our strategy to establish Intel Foundry as a major provider of foundry capacity to manufacture semiconductors for others, we face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries, UMC and SMIC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Samsung 列為晶圓代工領域的競爭對手。（以原文為準）

“As we pursue our strategy to establish Intel Foundry as a major provider of foundry capacity to manufacture semiconductors for others, we face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries, UMC and SMIC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 將 UMC 列為晶圓代工領域的競爭對手。（以原文為準）

“As we pursue our strategy to establish Intel Foundry as a major provider of foundry capacity to manufacture semiconductors for others, we face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries, UMC and SMIC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 將 SMIC 列為晶圓代工領域的競爭對手。（以原文為準）

“we entered into an agreement with NVIDIA to issue and sell to NVIDIA 215 million shares of our common stock at $23.28 per share for an aggregate cash purchase price of $5.0 billion.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 與 NVIDIA 簽訂協議，Intel 將向 NVIDIA 發行並出售 2.15 億股普通股，每股價格 23.28 美元，總現金購買價為 50 億美元。（以原文為準）

“SoftBank Group made a $2.0 billion investment in Intel common stock”

— INTC 8-K，申報於 2025-10-23 EDGAR · 查看原始申報文件 ↗

SoftBank Group 對 Intel 普通股進行了 20 億美元之投資。（以原文為準）