半導體晶圓代工與先進封裝 — 供應鏈地圖

“For the fiscal years ended June 30, 2026, 2025 and 2024, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Year Ended June 30, 2026 2025 2024 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited”

— KLAC 10-K，申報於 2026-08-06 EDGAR · 查看原始申報文件 ↗

KLA 在 FY2026、FY2025 及 FY2024 將 TSMC 列為佔總營收超過 10% 之客戶，主要來自半導體製程控制部門。（以原文為準）

“In Q2 FY26, we expect inventory to decrease as we continue to fulfill demand and manage our wafer purchase commitments per our long-term capacity agreement with GlobalFoundries.”

— CRUS 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

Cirrus Logic 預期其庫存將因履行需求並依長期產能協議管理對 GlobalFoundries 的晶圓採購承諾而減少。（以原文為準）

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 依賴 ASML 作為 EUV 微影設備之獨家供應商。（以原文為準）

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K，申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗

Credo 在 2026 會計年度獨家使用 TSMC 進行晶圓生產。（以原文為準）

“The primary raw material for Faraday ’s products is silicon wafers. Our principal supplier is UMC, a professional wafer foundry.”

— Faraday Technology Annual report，申報於 2026-05-25 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Faraday Technology 將 UMC 列為其主要矽晶圓供應商，UMC 為專業晶圓代工廠。（以原文為準）

“Samsung Electronics Co., Ltd. ("Samsung") accounted for 10% of total revenue in both fiscal years 2026 and 2025.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Samsung 在 2026 及 2025 兩個會計年度各佔 Qorvo 總營收的 10%。（以原文為準）

“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”

— ASX 20-F，申報於 2026-04-01 EDGAR · 查看原始申報文件 ↗

ASE 將 Kinsus 列為 IC 載板等原料的有限供應商之一。（以原文為準）

“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”

— ASX 20-F，申報於 2026-04-01 EDGAR · 查看原始申報文件 ↗

ASE 將 Nan Ya PCB 列為 IC 載板等原料的有限供應商之一。（以原文為準）

“If we are unable to obtain 300mm SOI wafers from Soitec S.A. (“Soitec”), our primary supplier, for any reason, we expect that it would take us an extended period to find a replacement supplier on commercially acceptable terms.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 表示，若無法從其主要供應商 Soitec 取得 300mm SOI 晶圓，預期需較長時間才能找到替代供應商。（以原文為準）

“All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ("OSATs") with our primary supplier being Advanced Semiconductor Engineering, Inc. ("ASE").”

— LSCC 10-K，申報於 2026-02-13 EDGAR · 查看原始申報文件 ↗

Lattice 的所有封測作業均由 OSAT 執行，主要供應商為 ASE。（以原文為準）

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K，申報於 2026-02-11 EDGAR · 查看原始申報文件 ↗

SiTime 主要依賴 TSMC 進行其類比電路的製造。（以原文為準）

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K，申報於 2026-02-11 EDGAR · 查看原始申報文件 ↗

SiTime 主要依賴 UMC 進行其類比電路製造。（以原文為準）

“we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 主要依賴 GlobalFoundries 供應大於 7nm 製程的微處理器與 GPU 晶圓。（以原文為準）

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 部分最先進的現有及未來產品將由 TSMC 獨家製造或依賴其關鍵元件。（以原文為準）

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗

在 2025 會計年度，來自 Samsung 的收入佔 Qualcomm 合併營收 10%以上。（以原文為準）

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K，申報於 2025-08-08 EDGAR · 查看原始申報文件 ↗

未在申報方最新年報（2026-08-06 申報之 Form 10-K）中再次確認：該年報未再提及

KLA 將 Samsung 列為佔其總營收 10% 以上之客戶（如原文表格所示），且該營收主要來自半導體製程控制部門。（以原文為準）

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 已與 Samsung 等主要 OEM 建立直接關係，並透過經銷商及 ODM 為其服務。（以原文為準）

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 於 2026 會計年度有 16.3% 的營收來自 NVIDIA。（以原文為準）

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 於 2026 會計年度有 19.9% 的營收來自 Cisco。（以原文為準）

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 於 2026 會計年度有 10.7% 的營收來自 Nokia。（以原文為準）

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 於 2026 會計年度有 10.5% 的營收來自 Amazon。（以原文為準）

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K，申報於 2026-08-07 EDGAR · 查看原始申報文件 ↗

Lam Research 將 Samsung 列為其 2024、2025 及 2026 會計年度的最重要客戶之一。（以原文為準）

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K，申報於 2026-08-07 EDGAR · 查看原始申報文件 ↗

Lam Research 將 TSMC 列為其 2024、2025 及 2026 會計年度的最重要客戶之一。（以原文為準）

“Secured TSMC buffer inventory for customers through 2029+ to ensure smooth foundry transition and prepare for AI ramp”

— NVTS 8-K，申報於 2026-07-27 EDGAR · 查看原始申報文件 ↗

Navitas 表示已為客戶取得 TSMC 至 2029 年以後之緩衝庫存，以因應晶圓代工轉換及 AI 業務成長。（以原文為準）

“IP revenue grew more than 40% year-over-year, driven by strong demand for Cadence’s Star IP portfolio, highlighted by a significant agreement with Intel and additional wins with leading semiconductor companies”

— CDNS 8-K，申報於 2026-07-27 EDGAR · 查看原始申報文件 ↗

Cadence 表示其 IP 營收成長得益於與 Intel 之重大協議及對其 Star IP 之強勁需求。（以原文為準）

“Vector Core Compute (VC2) unveiled a disaggregated agentic cloud combining Intel® Xeon® processors, SambaNova RDUs and NVIDIA Blackwell GPUs”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 的 Xeon 處理器獲 Vector Core Compute 採用於其雲端方案。（以原文為準）

“Intel expanded its purpose-built silicon business beyond networking and IPUs through a strategic collaboration with Fortinet to develop Fortinet Security Processor 6 using Intel's advanced design, packaging and manufacturing capabilities.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 與 Fortinet 策略合作，使用 Intel 的先進設計、封裝與製造能力開發 Fortinet Security Processor 6。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗

Credo 使用 Amkor 等第三方承包商進行 IC 產品的封裝、組裝和測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗

Credo 使用 ASE 進行其 IC 產品的封裝。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗

Credo 使用 King Yuan Electronics 進行其 IC 產品的測試。（以原文為準）

“Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (“JV”) in Koshi City, Kumamoto Prefecture, Japan.”

— TSM 6-K，申報於 2026-08-11 EDGAR · 查看原始申報文件 ↗

「索尼半導體解決方案公司（Sony）與台積公司今（11）日宣布雙方簽署具法律效力之最終合作協議，於日本熊本縣合志市成立合資公司Advanced Vision Semiconductor Manufacturing Corporation。此合資公司將採用先進製程技術，作為量產智慧型手機影像感測器所需之研發及製造的核心樞紐，並預計於2029年開始量產。」

— 台積電 重大訊息 · 發言日期 2026-08-11（第51款） · MOPS 查詢頁 ↗

（公司於證交所公開資訊觀測站發布之中文公告原文）

“Intel and Google announced a multiyear collaboration for continued deployment of Intel ® Xeon ® processors across Google’s workload-optimized instances, including the latest Intel ® Xeon ® 6 processors powering C4 and N4 instances. … The collaboration also includes co-development of custom ASIC infrastructure processing units (IPUs) designed to improve utilization, reduce complexity, and scale AI workloads more efficiently.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

Intel 與 Google/Alphabet 宣布多年合作，持續在 Google 的工作負載最佳化實例中部署 Intel Xeon 處理器，並共同開發客製化 ASIC 基礎設施處理單元。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Siemens 列為共同開發產業特定 AI 與運算解決方案之策略合作夥伴。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Hitachi 建立策略合作，共同開發由 Intel 處理器及專用晶片驅動的產業特定 AI 與運算解決方案。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Echo Neurotechnologies 建立策略合作，共同開發由 Intel 處理器及專用晶片驅動的產業特定 AI 與運算解決方案。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Greenstone Biosciences 列為共同開發 AI 與運算解決方案之策略合作夥伴。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Foxconn 建立策略合作關係，共同開發由 Intel 處理器驅動的產業特定人工智慧與運算解決方案。（以原文為準）

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F，申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗

Intel 與 UMC 合作，共同開發新的 12nm 半導體製程平台。（以原文為準）

“In addition, we partnered with Avalanche in 2018 for the joint development and production of MRAM, providing an alternative to embedded flash for 22nm technologies.”

— UMC 20-F，申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗

UMC 與 Avalanche 在 2018 年合作，共同開發及生產 MRAM，為 22 奈米技術提供嵌入式快閃記憶體以外的替代方案。（以原文為準）

“in November 2025, we announced a long-term strategic partnership with GlobalFoundries to develop and deliver advanced GaN solutions for critical applications in high power markets”

— NVTS 10-K，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

Navitas 與 GlobalFoundries 宣布建立長期策略合作夥伴關係，共同開發先進 GaN 解決方案。（以原文為準）

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K，申報於 2026-02-19 EDGAR · 查看原始申報文件 ↗

NXP 與 TSMC 共同持有合資公司 SSMC。（以原文為準）

“Announced a collaboration with Intel to jointly develop multiple generations of custom data center and PC products with NVIDIA NVLink.”

— NVDA 8-K，申報於 2025-11-19 EDGAR · 查看原始申報文件 ↗

NVIDIA 宣布與 Intel 合作，共同開發多代客製化資料中心與 PC 產品，並採用 NVIDIA NVLink。（以原文為準）

“GIGABYTE has formed strategic partnerships with major suppliers such as Intel, AMD, and NVIDIA”

— Gigabyte Technology Annual report，申報於 2026-06-09 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Gigabyte Technology 已與 Intel 等主要供應商建立策略夥伴關係。（以原文為準）

“The Company continues to deepen cooperation with AMD, Intel, and NVIDIA”

— Chenbro Micom Annual report，申報於 2026-05-29 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Chenbro Micom 持續深化與 Intel 的合作。（以原文為準）

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report，申報於 2026-05-25 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Faraday Technology 將 UMC 列為策略聯盟夥伴。（以原文為準）

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report，申報於 2026-05-25 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Faraday Technology 與 Samsung 存在策略聯盟關係。（以原文為準）

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report，申報於 2026-05-25 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Faraday Technology 將 Intel 列為策略聯盟夥伴。（以原文為準）

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report，申報於 2026-05-25 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Faraday Technology 宣布與 GlobalFoundries 正式建立策略合作夥伴關係。（以原文為準）

“These engagements build upon the previously announced partnership with Samsung Electronics.”

— AMAT 8-K，申報於 2026-05-14 EDGAR · 查看原始申報文件 ↗

Applied Materials 表示這些合作建立在先前宣布與 Samsung Electronics 的夥伴關係之上。（以原文為準）

“A new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI.”

— AMAT 8-K，申報於 2026-05-14 EDGAR · 查看原始申報文件 ↗

Applied Materials 宣布與 TSMC 建立創新夥伴關係，以加速 AI 時代所需半導體技術之開發與商業化。（以原文為準）

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Benchmark Electronics 列為光學製造服務市場的競爭對手之一。（以原文為準）

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Celestica 列為光學製造服務市場的競爭對手之一。（以原文為準）

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Innolight Technology Suzhou 列為光學製造服務市場的競爭對手之一。（以原文為準）

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Jabil 列為光學製造服務市場的競爭對手之一。（以原文為準）

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Sanmina 列為光學製造服務市場的競爭對手之一。（以原文為準）

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Venture 列為光學製造服務市場的競爭對手之一。（以原文為準）

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Eoptolink 列為光學製造服務市場的競爭對手之一。（以原文為準）

“Our customized optics and glass operations face competition from companies such as CASTECH Inc., Excelitas Technologies Corp. and Photop Technologies, Inc. (a subsidiary of Coherent Corp.).”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Castech 列為客製化光學及玻璃業務的競爭對手之一。（以原文為準）

“Our customized optics and glass operations face competition from companies such as CASTECH Inc., Excelitas Technologies Corp. and Photop Technologies, Inc. (a subsidiary of Coherent Corp.).”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Excelitas Technologies 列為客製化光學及玻璃業務的競爭對手之一。（以原文為準）

“Our customized optics and glass operations face competition from companies such as CASTECH Inc., Excelitas Technologies Corp. and Photop Technologies, Inc. (a subsidiary of Coherent Corp.).”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 將 Photop Technologies 列為客製化光學及玻璃業務的競爭對手之一。（以原文為準）

“Our major competitors in the DRAM market include Samsung Electronics Co., Ltd. (“Samsung Electronics”), Micron Technology, Inc. (“Micron Technology”) and ChangXin Memory Technologies (“CXMT”).”

— SKHY F-1/A，申報於 2026-07-06 EDGAR · 查看原始申報文件 ↗

SK Hynix 將 Samsung 列為 DRAM 市場之主要競爭對手。（以原文為準）

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F，申報於 2026-04-01 EDGAR · 查看原始申報文件 ↗

ASE 的封測業務面臨來自 TSMC 的競爭，因為 TSMC 提供了先進封裝技術如 InFO。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Intel 是 Marvell 的直接競爭對手之一。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 的主要競爭對手包括 TSMC。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 和 UMC 都是主要的競爭對手。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 將 SMIC 列為主要競爭對手之一。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 也與 Texas Instruments 等 IDM 的晶圓代工服務競爭。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 與 Samsung 等 IDM 的晶圓代工服務競爭。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 亦與部分 IDM 的晶圓代工服務競爭，例如 Intel 及 Samsung 等公司。（以原文為準）

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K，申報於 2026-02-25 EDGAR · 查看原始申報文件 ↗

NVIDIA 將 Intel 列為當前競爭對手之一。（以原文為準）

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K，申報於 2026-02-25 EDGAR · 查看原始申報文件 ↗

NVIDIA 將 Samsung 列為其 SoC 產品領域的現有競爭者之一。（以原文為準）

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K，申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗

Amkor 面臨來自 ASE 等亞洲封測服務提供者的競爭。（以原文為準）

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K，申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗

Amkor 在申報文件中指出 JCET 為其封測競爭對手。（以原文為準）

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K，申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗

Amkor 面臨來自 Powertech Technology 等封測服務提供者的競爭。（以原文為準）

“Competitors for certain of ISG's products and solutions include: Sony Semiconductor Manufacturing Corporation, Samsung Electronics Co., Ltd., and Omnivision Technologies Inc.”

— ON 10-K，申報於 2026-02-09 EDGAR · 查看原始申報文件 ↗

Samsung 是 onsemi 部分產品與解決方案的競爭對手之一。（以原文為準）