Analog & Power Semiconductors — Supply-Chain Map

“In 2025, 2024 and 2023, the Company’s largest customer, Apple, represented 17.7 %, 14.5 % and 12.3 % of consolidated net revenues”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“We also have a strong position with our distribution partners, including our five largest in alphabetical order, Arrow, Avnet, Nexty, WT Micro and World Peace. … Avnet accounted for 23% of our revenue in 2025 and 22% in 2024.”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“Furthermore, NXP has an agreed purchase commitment with VSMC that over the lifetime of the factory the minimal loading will be between 80% - 90%, resulting in a total purchase commitment of approximately $14,096 million that is expected to be purchased over 37 years once wafer production starts.”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K, filed 2026-02-06 · View source filing ↗

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K, filed 2026-02-06 · View source filing ↗

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K, filed 2026-02-06 · View source filing ↗

“In July 2023, the Company entered into the CRD Agreement with a customer, pursuant to which the customer agreed to provide the Company up to $2.0 billion in unsecured deposits. … with the potential for an increased variable rate of either 10% or 15% in connection with any inability of the Company to satisfy supply targets under a ten-year wafer supply agreement with the same customer. … Unsecured Customer Refundable Deposit Agreement, dated as of July 5, 2023, between Wolfspeed, Inc. and Renesas Electronics America Inc.”

— WOLF 10-K, filed 2025-08-26 · View source filing ↗

“Some of our products are manufactured at SMIC”

— MCHP 10-K, filed 2026-05-21 · View source filing ↗

“With the exception of Arrow Electronics, our largest distributor, which made up 12% and 10% of our net sales, in fiscal 2026 and in fiscal 2025, respectively, no distributor or direct customer accounted for more than 10% of our net sales.”

— MCHP 10-K, filed 2026-05-21 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“On February 6, 2026, the Company issued warrants to Amazon Web Services ("AWS") for the acquisition of up to 24.8 million ordinary shares of the Company. The warrants will vest in tranches over the term of the agreement, with vesting substantially tied to payments for the Company's products and services purchased by AWS and its affiliates.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Sales to Arrow Electronics, Inc., which were reported in our Electronics, Transportation, and Industrial segments, were 9.5%, 9.4%, and 11.2% of consolidated net sales in 2025, 2024, and 2023, respectively.”

— LFUS 10-K, filed 2026-02-19 · View source filing ↗

“Powersem GmbH: The Company owns 45 % of the outstanding equity of Powersem GmbH (“Powersem”), a module manufacturer based in Germany. … Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K, filed 2026-02-19 · View source filing ↗

“EB-Tech Co., Ltd.: The Company owns approximately 15 % of the outstanding equity of EB-Tech Co., Ltd. (“EB Tech”), a company with expertise in radiation technology based in South Korea. … Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K, filed 2026-02-19 · View source filing ↗

“Automated Technology (Phil), Inc. : The Company owns approximately 24 % of the outstanding common shares of Automated Technology (Phil), Inc. (“ATEC”), a supplier located in the Philippines that provides assembly and test services. … Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K, filed 2026-02-19 · View source filing ↗

“Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K, filed 2026-02-19 · View source filing ↗

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“the new 200mm SiC device manufacturing joint venture with Sanan Optoelectronics in Chongqing, China, as we announced on June 7 2023”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“Our assembly and test operations facility located in Leshan, China, which is owned by Leshan-Phoenix Semiconductor Company Limited, a joint venture company in which we own 80% of the outstanding equity interests ("Leshan"). The financial and operating results of Leshan have been consolidated in our financial statements. Our joint venture partner is Leshan Radio Company Ltd.”

— ON 10-K, filed 2026-02-09 · View source filing ↗

“we entered into a broad patent cross-license with Infineon Technologies AG.”

— NVTS 10-K, filed 2026-02-27 · View source filing ↗

“We announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement serving several product categories, to enable new high performance compute infrastructure for cloud and AI data centers.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“the joint 300mm semiconductor manufacturing facility with GlobalFoundries Inc in Crolles, France”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“On March 31, we announced the signature of an agreement on GaN technology development and manufacturing with Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing.”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K, filed 2026-05-08 · View source filing ↗

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K, filed 2026-05-08 · View source filing ↗

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K, filed 2026-05-08 · View source filing ↗

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K, filed 2026-05-08 · View source filing ↗

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K, filed 2026-05-08 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Semtech Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 · View source filing ↗

“Our primary GaN competitors include Infineon Technologies AG, Power Integrations, Inc., Texas Instruments Incorporated, Innoscience (Suzhou) Semiconductor Co., Ltd., Renesas Electronics Corp., and Efficient Power Conversion Corporation (EPC).”

— NVTS 10-K, filed 2026-02-27 · View source filing ↗

“Our primary GaN competitors include Infineon Technologies AG, Power Integrations, Inc., Texas Instruments Incorporated, Innoscience (Suzhou) Semiconductor Co., Ltd., Renesas Electronics Corp., and Efficient Power Conversion Corporation (EPC).”

— NVTS 10-K, filed 2026-02-27 · View source filing ↗