Wide-Bandgap Power (GaN & SiC) — Supply-Chain Map

“In 2025, 2024 and 2023, the Company’s largest customer, Apple, represented 17.7 %, 14.5 % and 12.3 % of consolidated net revenues”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K, filed 2026-02-06 EDGAR · View source filing ↗

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K, filed 2026-02-06 EDGAR · View source filing ↗

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K, filed 2026-02-06 EDGAR · View source filing ↗

“In July 2023, the Company entered into the CRD Agreement with a customer, pursuant to which the customer agreed to provide the Company up to $ 2.0 billion in unsecured deposits. … with the potential for an increased variable rate of either 10 % or 15 % in connection with any inability of the Company to satisfy supply targets under a ten-year wafer supply agreement with the same customer. … Unsecured Customer Refundable Deposit Agreement, dated as of July 5, 2023, between Wolfspeed, Inc. and Renesas Electronics America Inc.”

— WOLF 10-K, filed 2025-08-26 EDGAR · View source filing ↗

“Sales to WPG and Promate accounted for 53.0% and 19.3% of our revenue, respectively, for the fiscal year ended June 30, 2026”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Sales to WPG and Promate accounted for 53.0% and 19.3% of our revenue, respectively, for the fiscal year ended June 30, 2026”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Foundry Agreement dated as of January 10, 2002 between the Registrant and Shanghai Hua Hong NEC Electronics Company, Limited … Foundry Service Agreement dated as of November 2, 2009 between Alpha & Omega Semiconductor (Macau), Ltd. and Shanghai Hua Hong NEC Electronics Company, Limited”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“The Company is amortizing intangible assets of patents and technology rights related to a license agreement with STMicroelectronics International N.V.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“a Master Supply Agreement, pursuant to which the Company continued to operate the RTP Fab and supply MACOM with Epi wafers and fabrication services (the "RF Master Supply Agreement") through the date the RTP Fab Transfer is completed (the "RTP Fab Transfer Date") … a Long-Term Epi Supply Agreement (the "Long-Term Epi Supply Agreement"), pursuant to which MACOM will purchase Epi wafers from the Company from the RTP Fab Transfer Date until the fifth anniversary of the RTP Fab Transfer Date”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“Secured strategic AI data center platform wins with Great Wall, a leading China cloud infrastructure power supplier, expanding EliteSiC and silicon MOSFETs and controller content”

— ON 8-K, filed 2026-08-03 EDGAR · View source filing ↗

“Extended leadership in automotive zonal architecture and on-board charging with Rivian’s R2 platform with power solutions that enable efficient power distribution and conversion”

— ON 8-K, filed 2026-08-03 EDGAR · View source filing ↗

“Secured TSMC buffer inventory for customers through 2029+ to ensure smooth foundry transition and prepare for AI ramp”

— NVTS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“Announced new design win with Sineng Electric to power its 430kW liquid-cooled energy storage systems and 320 kW solar inverter”

— ON 8-K, filed 2026-05-04 EDGAR · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗

“Our US based GaN fabrication partner is GlobalFoundries.”

— NVTS 10-K, filed 2026-02-27 EDGAR · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“in November 2025, we announced a long-term strategic partnership with GlobalFoundries to develop and deliver advanced GaN solutions for critical applications in high power markets”

— NVTS 10-K, filed 2026-02-27 EDGAR · View source filing ↗

“the new 200mm SiC device manufacturing joint venture with Sanan Optoelectronics in Chongqing, China, as we announced on June 7 2023”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“Forged strategic partnership with Cyient Semiconductors to co-develop GaN products and build a local ecosystem in India, aiming to accelerate adoption and capitalize on industrial electrification under the "Make in India" initiative.”

— NVTS 8-K, filed 2026-02-24 EDGAR · View source filing ↗

“our assembly and test operations facility located in Leshan, China, which is owned by Leshan-Phoenix Semiconductor Company Limited, a joint venture company in which we own 80% of the outstanding equity interests ("Leshan"). The financial and operating results of Leshan have been consolidated in our financial statements. Our joint venture partner is Leshan Radio Company Ltd.”

— ON 10-K, filed 2026-02-09 EDGAR · View source filing ↗

“Launched a dedicated data center solutions team, based in Silicon Valley, to capitalize on and supplement growth in our fastest growing end market and a strategic collaboration with LITEON Technology.”

— WOLF 8-K, filed 2026-08-19 EDGAR · View source filing ↗

“Continued strength in companion chip momentum with announced partnerships with ASPEED BMC at Computex, and Texas Instruments Radar Sensor demonstrated at NVIDIA GTC.”

— LSCC 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Deepened collaboration with NVIDIA MGX Ecosystem, accelerating 800V DC rack architectures for next-gen AI DC’s”

— NVTS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“Strategic partnership with Magnachip licensing SiC technology to expand market access beyond Navitas focus markets”

— NVTS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“expanded collaborations with Geely and NIO”

— ON 8-K, filed 2026-05-04 EDGAR · View source filing ↗

“expanded collaborations with Geely and NIO”

— ON 8-K, filed 2026-05-04 EDGAR · View source filing ↗

“we entered into a broad patent cross-license with Infineon Technologies AG.”

— NVTS 10-K, filed 2026-02-27 EDGAR · View source filing ↗

“expanding our collaboration with Powerchip Semiconductor Manufacturing Corporation”

— NVTS 10-K, filed 2026-02-27 EDGAR · View source filing ↗

“we announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement serving several product categories, to enable new high performance compute infrastructure for cloud and AI data centers.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“The joint 300mm semiconductor manufacturing facility with GlobalFoundries Inc in Crolles, France”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“On March 31, we announced the signature of an agreement on GaN technology development and manufacturing with Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing.”

— STM 20-F, filed 2026-02-26 EDGAR · View source filing ↗

“Consolidated Asian distribution channel and forged strategic and global distribution partnership with WT Microelectronics and Avnet to accelerate GaN and high-voltage SiC adoption in AI data centers, high-performance computing and additional target end markets globally.”

— NVTS 8-K, filed 2026-02-24 EDGAR · View source filing ↗

“Consolidated Asian distribution channel and forged strategic and global distribution partnership with WT Microelectronics and Avnet to accelerate GaN and high-voltage SiC adoption in AI data centers, high-performance computing and additional target end markets globally.”

— NVTS 8-K, filed 2026-02-24 EDGAR · View source filing ↗

“Signed a memorandum of understanding (MoU) with Innoscience to explore expanding production of gallium nitride (GaN) power devices using Innoscience’s proven 200mm GaN-on-silicon process.”

— ON 8-K, filed 2026-02-09 EDGAR · View source filing ↗

“Established a new collaboration agreement with GlobalFoundries (GF) to develop and manufacture next-generation gallium nitride (GaN) power devices, beginning with 650V.”

— ON 8-K, filed 2026-02-09 EDGAR · View source filing ↗

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K, filed 2026-08-27 EDGAR · View source filing ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“As market adoption of the technology grows with rapidly expanding power device designs, we have experienced increased competition from companies such as SICC Co., LTD., and TanKeBlue Semiconductor Co., Ltd in China.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“As market adoption of the technology grows with rapidly expanding power device designs, we have experienced increased competition from companies such as SICC Co., LTD., and TanKeBlue Semiconductor Co., Ltd in China.”

— WOLF 10-K, filed 2026-08-20 EDGAR · View source filing ↗

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K, filed 2026-05-21 EDGAR · View source filing ↗

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K, filed 2026-05-21 EDGAR · View source filing ↗

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K, filed 2026-05-08 EDGAR · View source filing ↗

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K, filed 2026-05-08 EDGAR · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 EDGAR · View source filing ↗

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K, filed 2026-02-27 EDGAR · View source filing ↗